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Electronic Packaging

Engineering Capabilities: RF Modul, Digital & Rf, Hight Power

Preliminary and conceptual design for electronic units together with thermal/Dynamic/mechanic aspects using various analysis techniques. 

Board design, including layout & manufacturing definition for production.

Rigid/flex board design, including layout & manufacturing definition for production.

Board assembly Drawings.

Connectors definition for electronic systems.

System mechanical packaging design.

Transformation from design to manufacture